Semiconductor device including a plurality of first flat plates containing a material that absorbs an electromagnetic wave at a high frequency

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United States of America Patent

PATENT NO 8823053
APP PUB NO 20140077260A1
SERIAL NO

13780771

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Abstract

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The semiconductor device includes a plurality of first flat plates containing a material that absorbs an electromagnetic wave at a high frequency. Any of the first flat plates is disposed above the first connecting wire, and any other of the first flat plates is disposed above the second connecting wire.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOSHIBA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Morizuka, Kohei Himeji, JP 8 26
Sakiyama, Yoko Kawasaki, JP 5 58

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