Test assembly for verifying heat spreader grounding in a production test
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 2, 2014
Grant Date -
Sep 5, 2013
app pub date -
Mar 1, 2012
filing date -
Mar 1, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A test assembly (12) for testing a device (10) having a heat spreader (20), a package substrate (18) having a substrate ground (18G), and a grounding conductive segment (44A), includes (i) an input conductive segment (38) that is electrically connected to the heat spreader (20), (ii) a test board (28) having a board ground (30), and (iii) a control system (34) that is electrically coupled to the input conductive segment (38) and the board ground (30). During testing, the device (10) is positioned so that the substrate ground (18G) is electrically connected to the board ground (30). Additionally, the control system (34) directs a test current to one of the input conductive segment (38) and the board ground (30) to test the effectiveness of the grounding conductive segment (44A) including a first electrical interface (45A).
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully