Computational thermal analysis during microchip design
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United States of America Patent
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Sep 2, 2014
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app pub date -
Mar 27, 2013
filing date -
Mar 27, 2013
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Abstract
Some embodiments include a method for identifying high-temperature regions in a microchip. In some embodiments, the method includes selecting grids on the microchip, wherein each grid includes devices and interconnects connecting the devices. The method can also include determining, for each grid, a temperature factor value based on geometric area of the grid, geometric area occupied by the devices, switching factor of the of the interconnects, and length of the interconnects connecting the devices. The method can also include determining, for each grid, thermal sensitivity for the grid by generating a plot based on a Guassian equation.
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