Methods of profiling edges and removing edge beads

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United States of America Patent

PATENT NO 8826926
APP PUB NO 20120305030A1
SERIAL NO

13153834

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Abstract

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Some embodiments include methods for removing an edge bead after a photoresist application. Basic solution may be applied to the edge bead and removed with a vacuum, with the basic solution having a pH of at least about 14. Some embodiments include methods of profiling coatings along peripheral regions of substrates. A nozzle may be positioned above a peripheral region and oriented to direct a basic solution downwardly toward the peripheral region. A suction port may be positioned laterally outward of the peripheral region. Basic solution may be ejected from the nozzle toward the peripheral region, with the basic solution having a pH of at least about 14 and dissolving coating along the peripheral region. A vacuum may be provided within the suction port to pull the basic solution and the dissolved coating from the peripheral region.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boettiger, Thomas U Boise, US 1 4
Chalom, Michael E Meridian, US 1 4

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