Making multi-layer micro-wire structure

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United States of America Patent

PATENT NO 8828503
APP PUB NO 20140242297A1
SERIAL NO

13779939

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Abstract

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A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.

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Patent Owner(s)

Patent OwnerAddress
EASTMAN KODAK COMPANY343 STATE STREET ROCHESTER NY 14650-0208

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cok, Ronald Steven Rochester, US 217 2101
Lebens, John Andrew Rush, US 38 389
Trauernicht, David Paul Rochester, US 24 131
Wang, Yongcai Rochester, US 197 1457
Yau, Hwei-Ling Rochester, US 90 647

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