Electroconductive layer, laminate using the same, and producing processes thereof

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United States of America Patent

PATENT NO 8828554
APP PUB NO 20090197109A1
SERIAL NO

12352048

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Abstract

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The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 μm.

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Patent Owner(s)

Patent OwnerAddress
MEC COMPANY LTD1 HIGASHIHATSUSHIMA-CHO AMAGASAKI-SHI HYOGO 660-0832

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amatani, Tsuyoshi Amagasaki, JP 8 15
Fujii, Yuko Amagasaki, JP 12 98
Kawaguchi, Mutsuyuki Amagasaki, JP 9 29
Saito, Satoshi Amagasaki, JP 210 2550

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