Wafer level image sensor packaging structure and manufacturing method of the same
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United States of America Patent
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Sep 9, 2014
Grant Date -
Oct 6, 2011
app pub date -
Jan 25, 2011
filing date -
Apr 6, 2010
priority date (Note) -
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Abstract
The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process.
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