Air-dielectric for subtractive etch line and via metallization
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United States of America Patent
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Sep 9, 2014
Grant Date -
Jul 24, 2014
app pub date -
Mar 24, 2014
filing date -
Jan 25, 2011
priority date (Note) -
In Force
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Abstract
A method and structure is disclosed whereby multiple interconnect layers having effective air gaps positioned in regions most susceptible to capacitive coupling can be formed. The method includes providing a layer of conductive features, the layer including at least two line members disposed on a substrate and spaced from one another by less than or equal to an effective distance, and at least one such line member also having a via member extending away from the substrate, depositing a poorly conformal dielectric coating to form an air gap between such line members, and exposing a top end of the via.
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