Electroless copper deposition with suppressor

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United States of America Patent

PATENT NO 8828863
SERIAL NO

13926932

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for providing metal filled features in a layer is provided. A nonconformal metal seed layer is deposited on tops, sidewalls, and bottoms of the features, wherein more seed layer is deposited on tops and bottoms of features than sidewalls. The metal seed layer are etched back on tops, sidewalls, and bottoms of the features, wherein some metal seed layer remains on tops and bottoms of the features. Deposition on the seed layer on tops of the features is suppressed. An electroless “bottom up” deposition of metal is provided to fill the features.

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Patent Owner(s)

  • LAM RESEARCH CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bin, Xiaomin Fremont, US 5 7
Lee, William T Dublin, US 17 620

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