Chemical mechanical polishing of group III-nitride surfaces
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United States of America Patent
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Sep 9, 2014
Grant Date -
Oct 4, 2012
app pub date -
Mar 28, 2011
filing date -
Mar 28, 2011
priority date (Note) -
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Abstract
A method of chemically-mechanically polishing a substrate having a Group III-nitride surface includes providing a chemical-mechanical polishing slurry composition. The slurry composition includes a slurry solution including a liquid carrier and an oxidizer including a transition metal or a per-based compound. The slurry solution includes at least one component that reacts with the Group III-nitride surface to form a softened Group III-nitride surface. The Group III-nitride comprising surface is contacted with the slurry composition by a pad to form the softened Group III-nitride surface. The pad is moved relative to the softened Group III-nitride surface, wherein at least a portion of the softened Group III-nitride surface is removed.
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