Cooling system and electronic device including the cooling system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8830674
APP PUB NO 20130107452A1
SERIAL NO

13547482

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure discloses a cooling system and an electronic device. The cooling system is configured to cool a circuit board assembly in an orthogonal architecture, where the circuit board assembly is arranged inside a cabinet. The cooling system includes: a first cooling air duct that allows air to flow from the front area of the cabinet corresponding to the region of the circuit board assembly into the cabinet and flow through the front portion of the circuit board assembly, then be distributed into two lateral sides of the circuit board assembly, and be discharged out of the cabinet; and a second cooling air duct that allows air to flow from the front area of the cabinet corresponding to one end of the circuit board assembly into the cabinet and through the rear portion of the circuit board assembly, and then be discharged out of the cabinet.

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Patent Owner(s)

  • HUAWEI TECHNOLOGIES CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Qu, Zhijun Shenzhen, CN 21 157

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