Method for fabricating a semiconductor device and semiconductor production apparatus

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United States of America Patent

PATENT NO 8833422
SERIAL NO

13780337

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Importance

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Abstract

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A semiconductor production apparatus includes a supporting substrate having an upper surface to which a semiconductor substrate is bonded and a lower surface to which a back side grinding (BSG) tape is bonded, a stage having an upper surface on which a peeling tape is positioned such that an adhesive surface of the peeling tape is oriented upwards, and a handler which transfers the supporting substrate to the stage in a state such that the BSG tape bonded to the lower surface of the supporting substrate is oriented downwards toward the stage and positioned onto the peeling tape. A peeling unit draws the peeling tape to peel the BSG tape from the lower surface of the supporting substrate.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOSHIBA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yamashita, Daisuke Tokyo, JP 131 943

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