Method and system for removing contaminants

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United States of America Patent

PATENT NO 8834231
SERIAL NO

13055750

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Importance

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Abstract

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A method and apparatus for removing contaminants from at least one portion of a semiconductor mold are disclosed. A nozzle is positioned at a preset position with respect to the portion of the semiconductor mold. Solid particles of a material that sublimes instantaneously along with at least one of the abrasives and additives are blasted at a predefined temperature and/or pressure over the portion, through the nozzle. On impact, the particles remove the contaminants from the portion of the semiconductor mold.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
SHARMA SANDEEPNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sharma, Sandeep Singapore, SG 92 2506

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