Suspension board with circuit
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United States of America Patent
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Sep 16, 2014
Grant Date -
Aug 2, 2012
app pub date -
Jan 27, 2012
filing date -
Feb 1, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A suspension board with circuit includes an insulating base layer and a conductive pattern that is laminated on a top surface of the insulating base layer. The conductive pattern includes a wire and a terminal portion that is connected to the wire for being joined by a melted metal. The insulating base layer, in a projected surface when projected in a laminating direction, includes an adjacent region that is adjacent to the terminal portion and a separated region that is separated from the terminal portion so as to sandwich the adjacent region with the terminal portion. The adjacent region is formed to be thinner than the separated region.
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