Production method of connection structure

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United States of America Patent

PATENT NO 8835772
APP PUB NO 20120255766A1
SERIAL NO

13515425

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Abstract

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In order to lower the substantial heating temperature of a thermosetting adhesive and to realize favorable connection reliability during connecting an electrical element to a circuit board by anisotropic conductive connection with using solder particles, a product in which solder particles having a melting temperature Ts are dispersed in an insulating acrylic-based thermosetting resin having a minimum melt viscosity temperature Tv is used as an anisotropic conductive adhesive in producing a connection structure by connecting the circuit board and the electrical element to each other by anisotropic conductive connection.

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Patent Owner(s)

  • DEXERIALS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Igarashi, Satoshi Tochigi, JP 17 231

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