Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device
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United States of America Patent
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Sep 16, 2014
Grant Date -
Oct 10, 2013
app pub date -
Mar 13, 2013
filing date -
Apr 9, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a multilayered semiconductor device, including: a first semiconductor package including a first semiconductor element and a first wiring board; a second semiconductor package including: a second semiconductor element, a second wiring board and a first encapsulating resin for encapsulating the second semiconductor element therein; and a plate member disposed between the first semiconductor package and the second semiconductor package, the first semiconductor package, the plate member, and the second semiconductor package being stacked in this order, in which the first wiring board and the second wiring board are electrically connected to each other via a metal wire through one of a notch and an opening formed in the plate member and the first semiconductor element, the second semiconductor package, and the metal wire are encapsulated in a second encapsulating resin.
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