Semiconductor device with interconnection connecting to a via
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United States of America Patent
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Sep 16, 2014
Grant Date -
Sep 6, 2012
app pub date -
Feb 10, 2012
filing date -
Mar 1, 2011
priority date (Note) -
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Abstract
A semiconductor device including: a semiconductor substrate; a plurality of interconnect layers disposed at different heights from the semiconductor substrate, each interconnect layer including an interconnection formed therein; and a via formed in a columnar shape extending in the stack direction of the interconnect layers, the via electrically connecting the interconnections of the different interconnect layers, the interconnections including an intermediate interconnection in contact with the via in the intermediate portion thereof, and the intermediate interconnection including a first type intermediate interconnection passing through the via in a direction perpendicular to the stack direction and in contact with the via on the top surface, bottom surface, and both side surfaces thereof.
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