Package-on-package assembly with wire bond vias
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United States of America Patent
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Sep 16, 2014
Issued Date -
N/A
app pub date -
Feb 24, 2012
filing date -
Oct 17, 2011
priority date (Note) -
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Abstract
A microelectronic package can include wire bonds having bases bonded to respective conductive elements on a substrate and ends opposite the bases. A dielectric encapsulation layer extending from the substrate covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds which are uncovered by the encapsulation layer. Unencapsulated portions can be disposed at positions in a pattern having a minimum pitch which is greater than a first minimum pitch between bases of adjacent wire bonds.
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