Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices
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United States of America Patent
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Sep 16, 2014
Grant Date -
Jan 30, 2014
app pub date -
Sep 26, 2013
filing date -
Mar 10, 2009
priority date (Note) -
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Abstract
Electronic devices may include a first substrate bearing circuitry components at a nanoscale pitch within the first substrate. The first substrate may include microscale bond pads on a surface of the first substrate. A via may electrically connect one of the microscale bond pads to one of the circuitry components. A second substrate may be electrically connected to at least one of the microscale bond pads. Methods of forming electronic devices may include positioning a first substrate adjacent to a second substrate. The first substrate may bear circuitry components at a nanoscale pitch within the first substrate. The first substrate may include microscale bond pads on a surface of the first substrate. A via may electrically connect one of the microscale bond pads to one of the circuitry components. The second substrate may be electrically connected to at least one of the microscale bond pads.
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