Determining overall optimal yield point for a semiconductor wafer
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United States of America Patent
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Sep 16, 2014
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app pub date -
Jan 17, 2013
filing date -
Jan 17, 2013
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Abstract
A computer determines a component optimal yield point for each component of the plurality of components, where the component optimal yield point represents the process parameter values where maximum yield is achieved for a component. The computer determines a weight factor for each component of the plurality of components, where the weight factor represents an importance of a component to the semiconductor device. The computer then determines an overall optimal yield point based on the component yield point and weight factor determined for each component of the plurality of components, the overall optimal yield point representing the process parameter values where maximum yield is achieved for the semiconductor device.
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