Thermally compensated parallel optical communication module
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United States of America Patent
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Sep 23, 2014
Grant Date -
Feb 27, 2014
app pub date -
Aug 27, 2012
filing date -
Aug 27, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
In a parallel optical communication module, an array of opto-electronic devices secured with respect to a mount and an array of optical elements of an optical device that is also secured with respect to the mount are unconstrained against relative movement due to thermal expansion of the mount and optical device. The mount and optical device can be made of materials having similar coefficients of thermal expansion. As thermal expansion in the mount causes the opto-electronic devices to move, similar thermal expansion in the optical device causes the optical elements to move to a similar extent. This co-movement of the opto-electronic devices and optical elements to similar extents promotes continued maintenance of optical alignment between opto-electronic elements and corresponding optical elements.
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