High yield substrate assembly
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United States of America Patent
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Sep 23, 2014
Issued Date -
N/A
app pub date -
Jun 3, 2013
filing date -
Nov 18, 2011
priority date (Note) -
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Abstract
High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.
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