Method of forming vertical electronic fuse interconnect structures including a conductive cap

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United States of America Patent

PATENT NO 8841208
APP PUB NO 20140021578A1
SERIAL NO

13552106

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Abstract

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An electronic fuse structure including a first Mx metal comprising a conductive cap, an Mx+1 metal located above the Mx metal, wherein the Mx+1 metal does not comprise a conductive cap, and a via, wherein the via electrically connects the Mx metal to the Mx+1 metal in a vertical orientation.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bao, Junjing Fishkill, US 99 513
Huang, Elbert Emin Carmel, US 14 124
Li, Yan Zun Lagrangeville, US 13 54
Moy, Dan Bethel, US 33 772

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