Dicing tape-integrated wafer back surface protective film
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United States of America Patent
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Sep 23, 2014
Issued Date -
N/A
app pub date -
Dec 3, 2013
filing date -
Jan 30, 2009
priority date (Note) -
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Abstract
The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.
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