Integrated circuit package system with mold gate

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United States of America Patent

PATENT NO 8841782
APP PUB NO 20100038804A1
SERIAL NO

12192042

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Abstract

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An integrated circuit package system includes: providing a substrate; forming a conductive layer over the substrate; forming a mold gate layer having an organic material without polymerization over the conductive layer; and attaching an integrated circuit over the substrate adjacent the mold gate layer.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Youngcheol Youngin-si, KR 25 126
Lee, Tae Keun Ichon-si, KR 29 333
Yang, DaeWook Pyoungtaek-si, KR 8 52

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