Method for slicing a multiplicity of wafers from a crystal composed of semiconductor material

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United States of America Patent

PATENT NO 8844511
APP PUB NO 20110192388A1
SERIAL NO

13009957

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Abstract

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A method for slicing a plurality of wafers from a crystal includes providing a crystal of semiconductor material having a longitudinal axis, a cross section and at least one pulling edge. The crystal is fixed on a table and guided through a wire gang defined by sawing wire so as to form the wafers. The guiding is provided by a relative movement between the table and the wire gang such that entry sawing or exit sawing using the sawing wire occurs in a vicinity of the at least one pulling edge of the crystal.

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Patent Owner(s)

Patent OwnerAddress
SILTRONIC AG81677 MÜNCHEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blank, Albert Obing, DE 2 5
Kaeser, Maximilian Burghausen, DE 3 6

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