Methods of forming electrical contacts
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United States of America Patent
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-
Sep 30, 2014
Grant Date -
Dec 26, 2013
app pub date -
Jul 29, 2013
filing date -
May 23, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Some embodiments include methods of forming contacts. A row of projections may be formed over a semiconductor substrate. The projections may include a plurality of repeating components of an array, and a terminal projection. The terminal projection may have a sacrificial material spaced from semiconductor material of the substrate by a dielectric structure. An electrically conductive line may be formed along the row. The line may wrap around an end of the terminal projection and bifurcate into two branches that are along opposing sides of the repeating components. The individual branches may have regions spaced from the sacrificial material by segments of gate dielectric. The sacrificial material may be removed, together with the segments of gate dielectric, to form a contact opening. An electrically conductive contact may be formed within the contact opening and directly against the regions of the branches.
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