Resin composition, and prepreg and printed circuit board prepared using the same

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United States of America Patent

PATENT NO 8846790
APP PUB NO 20120279769A1
SERIAL NO

13190721

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Abstract

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A resin composition is provided. The resin composition comprises an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution obtainable from the following steps:

    (a) dissolving an N,O-heterocyclic compound of Formula I or Formula II into a first solvent to form a first reaction solution:

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Patent Owner(s)

Patent OwnerAddress
TAIWAN UNION TECHNOLOGY CORPORATIONNO 803 PO AI ST ZHUBEI CITY HSINCHU COUNTY TAIWAN R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hsien Te Chupei, TW 8 18
Liao, Chih Wei Chupei, TW 7 5
Lin, Tsung Hsien Chupei, TW 12 23
Liu, Cheng Ping Chupei, TW 2 2

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