Image sensor package structure with casing including a vent without sealing and in communication with package material
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United States of America Patent
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Sep 30, 2014
Grant Date -
Feb 3, 2011
app pub date -
Oct 15, 2009
filing date -
Jul 29, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.
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