Microelectronic assembly with thermally and electrically conductive underfill
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United States of America Patent
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Sep 30, 2014
Grant Date -
May 15, 2014
app pub date -
Nov 9, 2012
filing date -
Nov 9, 2012
priority date (Note) -
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Abstract
A microelectronic assembly may include a microelectronic element having a surface and a plurality of contacts at the surface; a first element consisting essentially of at least one of semiconductor or dielectric material, the first element having a surface facing the surface of the microelectronic element and a plurality of first element contacts at the surface of the first element; electrically conductive masses each joining a contact of the plurality of contacts of the microelectronic element with a respective first element contact of the plurality of first element contacts; a thermally and electrically conductive material layer between the surface of the microelectronic element and the surface of the first element and adjacent conductive masses of the conductive masses; and an electrically insulating coating electrically insulating the conductive masses and the surfaces of the microelectronic element and the first element from the thermally and electrically conductive material layer.
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