Integrated circuit package system with leads having multiple sides exposed

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8847413
APP PUB NO 20080171405A1
SERIAL NO

12014578

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Importance

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Abstract

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An integrated circuit package system includes forming an integrated circuit stack having a bottom non-active side and a top non-active side; connecting an internal interconnect between a lead, having a top side and a bottom side, and the integrated circuit stack; and forming an encapsulation, having both a non-elevated portion and an elevated portion, around the integrated circuit stack and the internal interconnect with the top side exposed at the non-elevated portion, and with the bottom side, the bottom non-active side, and the top non-active side exposed.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jang, Byoung Wook Yong-in, KR 19 172
Yee, Jae Hak Shanghai, CN 36 1001

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