Wiring board and method for making the same

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United States of America Patent

PATENT NO 8850700
SERIAL NO

12128238

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Importance

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Abstract

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A wiring board includes a substrate having an adhesive surface, a first wiring, and a second wiring. The adhesive surface is in contact with the first wiring and the second wiring. The first wiring has a penetrating hole extending in a direction perpendicular to the adhesive surface. The second wiring has a first region, a second region, and a third region, which are adjacent regions arranged in that order. The first region is inside the penetrating hole in the first wiring and in contact with a first portion of the adhesive surface that forms part of the penetrating hole. The second region is in contact with the first wiring and faces the first wiring and the substrate. The third region is in contact with a second portion of the adhesive surface outside the first portion.

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Patent Owner(s)

  • CANON KABUSHIKI KAISHA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sumida, Takayuki Kawasaki, JP 38 366

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