Method of forming patterns
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United States of America Patent
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Oct 7, 2014
Grant Date -
Feb 27, 2014
app pub date -
Nov 7, 2013
filing date -
Jun 12, 2007
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Abstract
A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film having a receding contact angle of 70 degrees or above with respect to water, wherein the resist composition for negative development contains a resin capable of increasing the polarity by the action of an acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation, (b) exposing the resist film via an immersion medium, and (c) performing development with a negative developer.
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