Resin composition and semiconductor device produced by using the same

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United States of America Patent

PATENT NO 8853312
SERIAL NO

13717009

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Abstract

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A quick curing resin composition, which can be used in conventionally used ovens, and a semiconductor device, which is excellent in reliability such as solder crack resistance or the like when the resin composition, is used as a die attach material for semiconductor. The resin composition has a sufficient low stress property, good adhesion and excellent bleeding property. The resin composition includes a filler (A), compound (B) having the structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.

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Patent Owner(s)

  • SUMITOMO BAKELITE CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Okubo, Hikaru Tochigi, JP 5 13
Tanaka, Nobuki Tochigi, JP 22 148
Watanabe, Itaru Tochigi, JP 33 368

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