Ball grid array (BGA) and printed circuit board (PCB) via pattern to reduce differential mode crosstalk between transmit and receive differential signal pairs

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United States of America Patent

PATENT NO 8853553
APP PUB NO 20140014404A1
SERIAL NO

13548234

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Abstract

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A ball grid array (BGA) and via pattern includes a printed circuit board (PCB) having a surface on which a plurality of regions are formed and a transmit (TX) and receive (RX) cluster comprising a transmit differential signal pair and a receive differential signal pair formed using at least a portion of the plurality of regions on the surface of the PCB, the transmit differential signal pair and the receive differential signal pair comprising nodes arranged in a diagonal orientation in which each node of the receive differential signal pair is equidistant from each node of the transmit differential signal pair.

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Patent Owner(s)

  • AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hinton, Mark A Fort Collins, US 4 34
Petaja, Regee Loveland, US 2 6
Quach, Minh V San Jose, US 2 6

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