Semiconductor structure with passive element network and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8853819
APP PUB NO 20120175731A1
SERIAL NO

13338087

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present invention relates to a semiconductor structure having an integrated passive network and a method for making the same. The semiconductor structure includes a substrate which can be an interposer. The substrate can include a plurality of conductive vias. In various embodiments, the substrate includes a dielectric layer disposed thereon, the dielectric layer having an opening forming a straight hole allowing electrical connection between the passive network and the conductive via. The passive network includes a series of patterned dielectric and conductive layers, forming passive electronic components. In an embodiment, the passive device includes a common resistor coupled to a pair of inductors, each of the inductors coupled to a capacitor. In another embodiment, the passive device includes a resistor and an inductor electrically connected to each other, a bottom surface of the inductor coplanar with a bottom surface of the resistor.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
ADVANCED SEMICONDUCTOR ENGINEERING, INC.KAOHSIUNG879

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-Hua Pingtung, TW 219 1633
Hsieh, Meng-Wei Tainan, TW 4 16
Lee, Teck-Chong Kaohsiung, TW 24 58
Shih, Hsu-Chiang Kaohsiung, TW 2 10

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (2)
6329631 Solder strip exclusively for semiconductor packaging 32 1999
2006/0027,632 Method for forming metal contacts on a substrate 26 2005
 
Complete Substrate Solutions Limited (1)
2002/0017,855 Visual display 24 2001
 
MICRON TECHNOLOGY, INC. (1)
5229647 High density data storage using stacked wafers 457 1992
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (3)
7557423 Semiconductor structure with a discontinuous material density for reducing eddy currents 6 2007
2009/0090,995 On-chip inductors with through-silicon-via fence for Q improvement 24 2007
2009/0140,383 METHOD OF CREATING SPIRAL INDUCTOR HAVING HIGH Q VALUE 12 2007
 
SAMSUNG ELECTRONICS CO., LTD. (1)
7262475 Image sensor device and method of manufacturing same 26 2005
 
MULTEK FLEXIBLE CIRCUITS, INC. (1)
5615477 Method for interconnecting a flip chip to a printed circuit substrate 189 1996
 
ROPER ASCENSION ACQUISITION, INC. (1)
2002/0094,605 Method for fabricating a stacked chip package 23 2002
 
HOYA CORPORATION (1)
5308443 Microprobe provided circuit substrate and method for producing the same 66 1992
 
LASERDYNAMICS, INC. (1)
4897708 Semiconductor wafer array 260 1986
 
ADVANCED INTERCONNECT SYSTEMS LIMITED (1)
6812549 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument 105 2002
 
STATS CHIPPAC PTE. LTE. (23)
2004/0124,518 Semiconductor stacked multi-package module having inverted second package and electrically shielded first package 85 2003
7553752 Method of making a wafer level integration package 47 2007
7691747 Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures 46 2007
2009/0146,297 Semiconductor Device and Method of Forming Wafer Level Ground Plane and Power Ring 64 2007
2009/0166,785 Semiconductor Device with Optical Sensor and Method of Forming Interconnect Structure on Front and Backside of the Device 45 2007
2009/0243,045 Through Hole Vias at Saw Streets Including Protrusions or Recesses for Interconnection 48 2008
7666711 Semiconductor device and method of forming double-sided through vias in saw streets 32 2008
7741156 Semiconductor device and method of forming through vias with reflowed conductive material 51 2008
2009/0302,435 Semiconductor Device and Method of Shielding Semiconductor Die from Inter-Device Interference 84 2008
2009/0302,437 Semiconductor Device and Method of Connecting a Shielding Layer to Ground Through Conductive Vias 55 2008
2009/0309,235 Method and Apparatus for Wafer Level Integration Using Tapered Vias 90 2008
2010/0059,855 Semiconductor Device and Method of Forming a Fan-Out Structure with Integrated Passive Device and Discrete Component 39 2008
2010/0065,948 Semiconductor Device and Method of Forming a Fan-In Package-on-Package Structure Using Through-Silicon Vias 44 2008
7772081 Semiconductor device and method of forming high-frequency circuit structure and method thereof 50 2008
2010/0133,704 Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias 186 2008
7858441 Semiconductor package with semiconductor core structure and method of forming same 26 2008
7741148 Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support 38 2008
2010/0140,751 Semiconductor Device and Method of Forming a Conductive Via-in-Via Structure 30 2008
2010/0140,752 Semiconductor Device and Method of Forming Compliant Polymer Layer Between UBM and Conformal Dielectric Layer/RDL for Stress Relief 41 2008
2010/0148,316 Semiconductor Device and Method of Forming Topside and Bottom-side Interconnect Structures Around Core Die with TSV 56 2008
7786008 Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereof 36 2008
7733661 Chip carrier and fabrication method 24 2009
2010/0140,737 Semiconductor Device and Method for Forming Passive Circuit Elements With Through Silicon Vias to Backside Interconnect Structures 26 2010
 
SOCIONEXT INC. (1)
6457633 Method of forming a BGA-type semiconductor device having reliable electrical connection for solder balls 27 1999
 
AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD. (1)
4842699 Method of selective via-hole and heat sink plating using a metal mask 86 1988
 
AMKOR TECHNOLOGY, INC. (6)
6406934 Wafer level production of chip size semiconductor packages 68 2000
6577013 Chip size semiconductor packages with stacked dies 306 2000
6448506 Semiconductor package and circuit board for making the package 66 2000
6740950 Optical device packages having improved conductor efficiency, optical coupling and thermal transfer 28 2002
6962829 Method of making near chip size integrated circuit package 109 2002
7334326 Method for making an integrated circuit substrate having embedded passive components 39 2005
 
KABUSHIKI KAISHA TOSHIBA (1)
4807021 Semiconductor device having stacking structure 319 1987
 
TESSERA, INC. (2)
7298030 Structure and method of making sealed capped chips 48 2004
2005/0189,635 Packaged acoustic and electromagnetic transducer chips 91 2005
 
BELL TELEPHONE LABORATORIES, INCORPORATED (1)
4385966 Fabrication of thin film resistors and capacitors 6 1980
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
2011/0079,917 Interposer structure with passive component and method for fabricating same 7 2009
 
NODA SCREEN CO., LTD. (1)
6276599 Method and apparatus for forming solder bumps 30 1999
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (27)
7285434 Semiconductor package and method for manufacturing the same 25 2005
7842597 Chip package, chip packaging, chip carrier and process thereof 26 2005
7371602 Semiconductor package structure and method for manufacturing the same 25 2005
2006/0197,216 Semiconductor package structure and method for manufacturing the same 53 2005
7238590 Package structure of semiconductor and wafer-level formation thereof 23 2005
7642132 Three-dimensional package and method of making the same 23 2006
7528053 Three-dimensional package and method of making the same 25 2006
7741152 Three-dimensional package and method of making the same 33 2006
7560744 Package optical chip with conductive pillars 24 2006
2007/0187,711 Wafer level package for image sensor components and fabricating method thereof 32 2006
7808060 MEMS microphone module and method thereof 32 2007
7681779 Method for manufacturing electric connections in wafer 24 2008
2008/0272,486 CHIP PACKAGE STRUCTURE 30 2008
7625818 Method for forming vias in a substrate 27 2008
7816265 Method for forming vias in a substrate 24 2008
7811858 Package and the method for making the same, and a stacked package 23 2008
2009/0140,436 METHOD FOR FORMING A VIA IN A SUBSTRATE AND SUBSTRATE WITH A VIA 29 2008
2009/0321,916 SEMICONDUCTOR STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR PACKAGE 24 2009
2010/0327,465 PACKAGE PROCESS AND PACKAGE STRUCTURE 36 2009
2011/0048,788 Method for forming a via in a substrate and substrate with a via 24 2009
2010/0230,759 Silicon Chip Having Through Via and Method for Making the Same 29 2009
2010/0187,681 Silicon Substrate Having Through Vias and Package Having the Same 24 2010
2010/0230,788 CHIP STRUCTURE, WAFER STRUCTURE AND PROCESS OF FAABRICATING CHIP 23 2010
2010/0230,760 Silicon Wafer Having Interconnection Metal 23 2010
2010/0244,244 Chip Having a Bump and Package Having the Same 25 2010
2010/0276,690 Silicon Wafer Having Testing Pad(s) and Method for Testing The Same 23 2010
2011/0068,437 Semiconductor Element Having a Conductive Via and Method for Making the Same and Package Having a Semiconductor Element with a Conductive Via 26 2010
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
5239448 Formulation of multichip modules 255 1991
5404044 Parallel process interposer (PPI) 220 1993
2007/0048,896 Conductive through via structure and process for electronic device carriers 121 2005
 
GENERAL ELECTRIC COMPANY (1)
4499655 Method for making alignment-enhancing feed-through conductors for stackable silicon-on-sapphire 98 1982
 
QUALCOMM INCORPORATED (4)
* 6495912 Structure of ceramic package with integrated passive devices 32 2001
2004/0245,580 [CHIP STRUCTURE WITH A PASSIVE DEVICE AND METHOD FOR FORMING THE SAME] 20 2004
2010/0308,435 Through Silicon Via With Embedded Decoupling Capacitor 34 2009
2011/0084,358 Apparatus and Method for Through Silicon via Impedance Matching 11 2009
 
IMEC (1)
2004/0259,292 Method for producing electrical through hole interconnects and devices made thereof 59 2004
 
LUCENT TECHNOLOGIES INC. (2)
5948216 Method for making thin film tantalum oxide layers with enhanced dielectric properties and capacitors employing such layers 11 1996
6075691 Thin film capacitors and process for making them 68 1997
 
CHIPPAC, INC. (1)
2005/0258,545 Multiple die package with adhesive/spacer structure and insulated die surface 30 2004
 
SILICONWARE PRECISION INDUSTRIES CO., LTD. (3)
2009/0032,928 Multi-chip stack structure having through silicon via and method for fabrication the same 45 2008
2009/0039,527 Sensor-type package and method for fabricating the same 62 2008
2009/0294,959 Semiconductor package device, semiconductor package structure, and fabrication methods thereof 25 2008
 
HITACHI TOHBU SEMICONDUCTOR, LTD. (1)
4982265 Semiconductor integrated circuit device and method of manufacturing the same 390 1988
 
GLOBALFOUNDRIES INC. (2)
5998292 Method for making three dimensional circuit integration 434 1997
7276787 Silicon chip carrier with conductive through-vias and method for fabricating same 84 2003
 
FUJITSU LIMITED (4)
5643831 Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device 114 1995
5872696 Sputtered and anodized capacitors capable of withstanding exposure to high temperatures 45 1997
7222420 Method for making a front and back conductive substrate 72 2004
7227736 Capacitor device and method of manufacturing the same 17 2005
 
BELL SEMICONDUCTOR, LLC (1)
5977582 Capacitor comprising improved TaO.sub.x -based dielectric 63 1997
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (15)
6699787 Semiconductor device and method of production of same 81 2002
6670269 Method of forming through-hole or recess in silicon substrate 36 2002
6815348 Method of plugging through-holes in silicon substrate 26 2003
7078269 Substrate fabrication method and substrate 26 2004
7388293 Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions 44 2005
* 2006/0017,133 Electronic part-containing elements, electronic devices and production methods 6 2005
7365436 Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same 29 2005
7508079 Circuit substrate and method of manufacturing the same 31 2006
7656023 Electronic parts packaging structure and method of manufacturing the same 26 2006
7415762 Interposer, method of fabricating the same, and semiconductor device using the same 27 2006
7605463 Interposer and method for producing the same and electronic device 29 2006
7508057 Electronic component device 24 2007
7772118 Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same 26 2008
7678685 Interposer and method for producing the same and electronic device 27 2008
7795140 Method of manufacturing substrate 27 2008
 
NEW ENERGY AND INDUSTRIAL TECHNOLOGY DEVELOPMENT ORGANIZATION (1)
5191405 Three-dimensional stacked LSI 186 1989
 
CUFER ASSET LTD. L.L.C. (12)
7157372 Coaxial through chip connection 94 2006
7215032 Triaxial through-chip connection 35 2006
7482272 Through chip connection 52 2006
7538033 Post-attachment chip-to-chip connection 37 2006
7786592 Chip capacitive coupling 46 2006
7808111 Processed wafer via 37 2006
2007/0138,562 COAXIAL THROUGH CHIP CONNECTION 71 2006
7598163 Post-seed deposition process 23 2007
7659202 Triaxial through-chip connection 34 2007
7687397 Front-end processed wafer having through-chip connections 23 2007
2010/0140,776 TRIAXIAL THROUGH-CHIP CONNECTON 29 2010
2010/0197,134 COAXIAL THROUGH CHIP CONNECTION 26 2010
 
AT & T TECHNOLOGIES, INC., (1)
4410867 Alpha tantalum thin film circuit device 36 1980
 
THE BOEING COMPANY (1)
5166097 Silicon wafers containing conductive feedthroughs 137 1990
 
Ultrasource, Inc. (5)
6761963 Integrated thin film capacitor/inductor/interconnect system and method 21 2001
6890629 Integrated thin film capacitor/inductor/interconnect system and method 11 2003
6998696 Integrated thin film capacitor/inductor/interconnect system and method 8 2003
7327582 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
7446388 Integrated thin film capacitor/inductor/interconnect system and method 8 2005
 
INTERSIL CORPORATION (1)
4394712 Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers 198 1981
 
Sychip Inc. (1)
7259077 Integrated passive devices 12 2004
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
7134198 Method for manufacturing electric element built-in module with sealed electric element 70 2003
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
STMICROELECTRONICS (CROLLES 2) SAS (1)
* 9117693 Passive integrated circuit 1 2011
* Cited By Examiner

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Apr 7, 2018
7.5 Year Payment $3600.00 $1800.00 $900.00 Apr 7, 2022
11.5 Year Payment $7400.00 $3700.00 $1850.00 Apr 7, 2026
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00