Integrated circuit packaging system with conductive pillars and molded cavities and method of manufacture thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8853855
APP PUB NO 20130241053A1
SERIAL NO

13422649

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Abstract

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A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a conductive post on the substrate, the conductive post includes a vertical side; attaching an integrated circuit to the substrate; and forming an encapsulant including a molded cavity, the vertical side circumscribed by and exposed within the molded cavity from the encapsulant.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, DaeSik Seoul, KR 93 2111
Lee, KyungHoon Icheon, KR 70 917
Lee, Sooyoung Icheon-si, KR 10 82

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