Chip resistor device and method for fabricating the same

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United States of America Patent

PATENT NO 8854175
APP PUB NO 20140055228A1
SERIAL NO

13790064

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Abstract

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A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes.

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Patent Owner(s)

Patent OwnerAddress
RALEC ELECTRONIC CORPORATION1 CENTRAL 2ND ST N E P Z KAOHSIUNG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Wan-Ping Kaohsiung, TW 3 2

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