Integrated circuit package with transformer
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United States of America Patent
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Oct 7, 2014
Grant Date -
Jan 3, 2013
app pub date -
Sep 12, 2012
filing date -
Dec 12, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Aspects of a method and system for a transformer in an integrated circuit package are provided. In this regard, signals may be transmitted and/or received via an antenna communicatively coupled to a transformer embedded in multi-layer integrated circuit package. The windings ratio of the transformer may be configured based on an impedance of the antenna, an impedance of a transmitter coupled to the transformer, an impedance of an LNA coupled to the transformer, and/or a power level of the received and/or transmitted signals. The windings ratio may be configured via one or more switching elements which may be MEMS switches embedded in the multi-layer IC package. The transformer may comprise a plurality of loops fabricated on a corresponding plurality of metal layers in the multi-layer IC package, and the loops may be communicatively coupled with one or more vias. The multi-layer IC package may comprise ferromagnetic and/or ferromagnetic materials.
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