Processing method for an ink jet head substrate
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United States of America Patent
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Oct 14, 2014
Grant Date -
Jun 27, 2013
app pub date -
Dec 7, 2012
filing date -
Dec 26, 2011
priority date (Note) -
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Abstract
Provided is a processing method for an ink jet head substrate, including: forming a barrier layer on a substrate and forming a seed layer on the barrier layer; forming a resist film on the seed layer and patterning the resist film so that the patterned resist film corresponds to a pad portion for electrically connecting an ink jet head to an outside of the ink jet head; forming the pad portion in an opening of the patterned resist film; removing the resist film; subjecting the substrate to anisotropic etching to form an ink supply port; removing the barrier layer and the seed layer; and performing laser processing from a surface of the substrate.
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