Enhanced etch and deposition profile control using plasma sheath engineering
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United States of America Patent
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Oct 14, 2014
Grant Date -
Feb 6, 2014
app pub date -
Oct 16, 2013
filing date -
Apr 3, 2009
priority date (Note) -
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Abstract
A plasma processing tool is used to deposit material on a workpiece. For example, a method for conformal deposition of material is disclosed. In this embodiment, the plasma sheath shape is modified to allow material to impact the workpiece at a range of incident angles. By varying this range of incident angles over time, a variety of different features can be deposited onto. In another embodiment, a plasma processing tool is used to etch a workpiece. In this embodiment, the plasma sheath shape is altered to allow ions to impact the workpiece at a range of incident angles. By varying this range of incident angles over time, a variety of differently shaped features can be created.
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