Ingot mold for silicon ingot and method for making the same

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United States of America Patent

PATENT NO 8859034
SERIAL NO

12694566

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Abstract

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A method for forming a mold comprises forming a body by kneading a ceramic powder comprising a silicon nitride powder and a first binder solution; forming a slurry by adding a second binder solution to the body; and forming a release layer by attaching the slurry to a surface of a mold base. A method for manufacturing a solar cell element comprises forming a silicon ingot by solidifying a silicon melt in the mold obtained by the above-described method for forming a mold; slicing the silicon ingot into substrates each having a predetermined thickness; forming a diffusion layer on each of the substrates; and forming an electrode on a surface of the diffusion layer.

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Patent Owner(s)

Patent OwnerAddress
KYOCERA CORPORATIONKYOTO-SHI KYOTO 612-8501

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gotoh, Shigeru Higashiomi, JP 5 57
Okushima, Kentaro Higashiomi, JP 2 11
Sakai, Youhei Higashiomi, JP 23 108

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