Integrated circuit packaging system with substrate mold gate and method of manufacture thereof
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United States of America Patent
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Oct 14, 2014
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app pub date -
Dec 14, 2011
filing date -
Dec 14, 2011
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a mold gate on an upper surface of the substrate; mounting an integrated circuit to the substrate; and forming an encapsulant encapsulating the integrated circuit, the encapsulant having disruption patterns emanating from the mold gate and underneath a bottom plane of the integrated circuit.
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