Integrated circuit packaging system with a shield and method of manufacture thereof

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United States of America Patent

PATENT NO 8861221
SERIAL NO

12890371

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Abstract

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A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first integrated circuit over the substrate; forming an encapsulant around the first integrated circuit and over the substrate; and forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pagaila, Reza Argenty Singapore, SG 44 1044

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