Microelectromechanical three-axis capacitive accelerometer

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United States of America Patent

PATENT NO 8863575
APP PUB NO 20120000287A1
SERIAL NO

13161345

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A micromechanical structure for a MEMS structure is provided with: a substrate; a single inertial mass having a main extension in a plane and arranged suspended above the substrate; and a frame element, elastically coupled to the inertial mass by coupling elastic elements and to anchorages, which are fixed with respect to the substrate by anchorage elastic elements. The coupling elastic elements and the anchorage elastic elements are configured so as to enable a first inertial movement of the inertial mass in response to a first external acceleration acting in a direction lying in the plane and also a second inertial movement of the inertial mass in response to a second external acceleration acting in a direction transverse to the plane.

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Patent Owner(s)

  • STMICROELECTRONICS S.R.L.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
De, Masi Biagio Corsano, IT 6 47
Frangi, Attilio Milan, IT 6 32
Simoni, Barbara Leghorn, IT 20 248

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