Polishing composition

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United States of America Patent

PATENT NO 8864860
APP PUB NO 20090173910A1
SERIAL NO

12341241

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Abstract

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To provide a polishing composition which can satisfy both suppression of the surface topography and a high stock removal rate, in a polishing step in the production of a wiring structure.

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Patent Owner(s)

  • FUJIMI INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirano, Tatsuhiko Kiyosu, JP 23 223
Mizuno, Hiroshi Kiyosu, JP 277 2823
Yamato, Yasuyuki Kiyosu, JP 17 64
Yasui, Akihito Kiyosu, JP 6 39

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