Method for manufacturing copper nanoparticles using microwaves

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United States of America Patent

PATENT NO 8864871
SERIAL NO

11892711

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Abstract

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The present invention relates to a method for manufacturing copper nanoparticles, in particular, to a method for manufacturing copper nanoparticles, wherein the method includes preparing a mixture solution including a copper salt, a dispersing agent, a reducing agent and an organic solvent; raising temperature of the mixture solution up to 30-50° C. and agitating; irradiating the mixture solution with microwaves; and obtaining the copper nanoparticles by lowering temperature of the mixture solution.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU GYEONGGI-DO SUWON-SI 16674

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Joung, Jae-Woo Suwon-si, KR 97 489
Lee, Young-Il Anyang-si, KR 16 125

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