Photosensitive resin composition and cured product thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8865392
APP PUB NO 20130108961A1
SERIAL NO

13809286

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Abstract

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Disclosed is a photosensitive resin composition containing a cationic photopolymerization initiator (A) and an epoxy resin (B) having two or more epoxy groups in each molecule, which is characterized in that the cationic photopolymerization initiator (A) is a cationic photopolymerization initiator (A-1) that is represented by formula (1).

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Patent Owner(s)

  • NIPPON KAYAKU KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Honda, Nao Tokyo, JP 14 110
Imaizumi, Naoko Tokyo, JP 9 33
Kiyoyanagi, Tadayuki Tokyo, JP 7 30
Oonishi, Misato Tokyo, JP 3 10
Sakai, Ryo Tokyo, JP 92 685

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