Chips with high fracture toughness through a metal ring
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United States of America Patent
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Oct 21, 2014
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N/A
app pub date -
Jan 2, 2014
filing date -
Nov 11, 2011
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Abstract
A method of making an edge-reinforced microelectronic element is disclosed. The steps include mechanically cutting along dicing lanes of a substrate at least partially through a thickness thereof to form a plurality of edge surfaces extending away from a front surface thereof and forming a continuous monolithic metallic edge-reinforcement ring that covers each of the plurality of edge surfaces and extends onto the front surface. The front surface may have a plurality of contacts thereat and the substrate may embody a plurality of microelectronic elements.
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