LED module
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United States of America Patent
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Oct 21, 2014
Grant Date -
Jul 18, 2013
app pub date -
Sep 26, 2011
filing date -
Sep 27, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
An LED module includes: a package having electrodes provided on the outer surface of opposing sidewalls, and a light-emitting element connected to the electrodes and mounted on the package; a base member having a copper metal; an insulating layer stacked on the surface of the base member and having an insulating material; and a conductive wiring pattern connected to the electrodes by soldering and formed on the surface of the insulating layer. The insulating layer has a through-hole formed by removing a part of the section where the package is positioned, and a heat dissipation unit formed by soldering between the back surface of the package and the base member, which face one another with the through-hole interposed therebetween.
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